The problem of solder pads not eating tin is usually caused by the following main reasons: 1 Improper surface treatment, 2 Flux problem, 3 Soldering method problem, 4 Reflow soldering problem, 5 Board design problem 6 Improper storage.
Zhongshan Lewei Electronic Technology Co., Ltd. Solution:
1.Cleaning treatment: Perform thorough cleaning before soldering, use professional cleaning solvents or ultrasonic cleaning equipment to ensure that the surface of the pad is clean and free of impurities.
2.Optimize soldering method: Adjust the soldering temperature and time to ensure that the soldering temperature is sufficient, the time is sufficient and the speed is moderate. Choose the right soldering equipment and master the correct operating skills.
3.Check the reflow soldering parameters: Adjust the preheating time and temperature to ensure that the flux activity is normal and avoid too low or too high temperature.
4.Optimize the design: Ensure that the size and shape of the pad meet the welding standards and avoid too small or irregular pads. Reasonably layout the pads to avoid too dense solder flow.
Optimize the connection method between the pad and the copper skin to ensure uniform heating.
Our company successfully solved the problem of pads not eating tin through the above methods.
